part number: XZTHI55W-3 3.2x1.6mm infrared emitting diode oct 12,2016 xdsa1797 v9-z layout: maggie l. p. 1/4 features long life and robust package standard package: 2,000pcs/ reel msl (moisture sensitivity level): 3 rohs compliant absolute maximum ratings (t a =25c) thi (gaalas) unit reverse voltage v r 5 v forward current i f 50 ma forward current (peak) 1/100 duty cycle 10us pulse width i fs 1200 ma power dissipation p d 80 mw operating temperature t a -40 ~ +85 c storage temperature tstg -40 ~ +85 package schematics notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.2(0.008") unless otherwise noted. 3. specifications are subjec t to change without notice. thi (gaalas) unit forward voltage (typ.) (i f =20ma) v f 1.3 v forward voltage (max.) (i f =20ma) v f 1.6 v reverse current (max.) (v r =5v) i r 10 ua wavelength of peak emission cie127-2007*(typ.) (i f =20ma) p 880* nm spectral line full width at half-maximum (typ.) (i f =20ma) 50 nm capacitance (typ.) (v f =0v, f=1mhz) c 90 pf operating characteristics (t a =25c) part number emitting material lens-color wavelength cie127-2007* nm p viewing angle 2 1/2 min. typ. XZTHI55W-3 gaalas water clear 1.6* 3.8* 880* 40 radiant intensity cie127-2007* (po = mw/sr) @20ma *radiant intensity value and wavelength ar e in accordance with cie127-2007 standards. a relative humidity between 40% and 60% is recommended in esd-protected work areas to reduce static build up during assembly process (reference jedec/jesd625-a and jedec/j-std-033)
part number: XZTHI55W-3 3.2x1.6mm infrared emitting diode oct 12,2016 xdsa1797 v9-z layout: maggie l. p. 2/4 ? thi led is recommended for reflow soldering and soldering profile is shown below.
part number: XZTHI55W-3 3.2x1.6mm infrared emitting diode oct 12,2016 xdsa1797 v9-z layout: maggie l. p. 3/4 remarks: if special sorting is required (e.g. binning based on forward voltage or radiant intensity / luminous flux), the typical accuracy of the so rting process is as follows: 1. radiant intensity / luminous flux: +/-15% 2. forward voltage: +/-0.1v note: accuracy may depend on the sorting parameters ? the device has a single mounting surface. the device must be mounted according to the specifications. ? reel dimension ? recommended soldering pattern (units : mm; tolerance: 0.1) ? tape specification (units : mm)
part number: XZTHI55W-3 3.2x1.6mm infrared emitting diode oct 12,2016 xdsa1797 v9-z layout: maggie l. p. 4/4 packing & label specifications terms of use 1. data presented in this document reflect statistical figures and should be treated as technical reference only. 2. contents within this document are subject to improvement and enhancement changes without notice. 3. the product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. user accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. the product(s) described in this document are intended for electronic applications in which a person?s life is not reliant u pon the led. please consult with a sunled representative for special applications where the led may have a direct impact on a person?s life. 5. the contents within this document may not be altered without prior consent by sunled. 6. additional technical notes are available at http://www.sunledusa.co m/technicalnotes.asp ?
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